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Hangzhou Neoden Technology Co.,Ltd


Steven Xiao

Call: 86-18167133317

Fax: 86-571-26266866

E-mail: steven@neodentech.com

Reflow Soldering Techniques Produce A Background

- Jan 09, 2018 -

Reflow soldering techniques produce a background

Due to the continuous miniaturization of PCBs for electronic products, sheet-like components have emerged and the traditional welding methods can no longer meet the needs. At first, the reflow soldering process was used only for the assembly of hybrid integrated circuits. Most of the components for assembly and soldering were chip capacitors, chip inductors, mounted transistors and diodes. With the development of SMT technology, the reflow soldering technology and equipment as a part of the mounting technology have also been developed. The application of SMC and SMD is becoming more and more widespread. Almost all electronic products have been applied.


Hangzhou NeoDen Technology Co.,Ltd

Add: Building 3,Diaoyu Industrial and Technology Park,No.8-2,Keji Avenue, Yuhang District, Hangzhou,China

Contact us: Steven Xiao                                                              

Phone: 86-18167133317                                                            

Fax: 86-571-26266866                                                            

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E-mail: steven@neodentech.com  

 

After-sales Support & Service

Mobile: +86-17682319935

Phone: +86-571-26266201

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E-mail: support@neodentech.com


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